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  (0,80mm) .0315" qse series blade & beam design integral metal plane for power or ground qse?060?01?f?d?a qse?028?01?f?d?dp?a?rt1 qse?020?01?l?d?a?rt1 www.samtec.com for complete speci cations and recommended pcb layouts see www.samtec.com?qse insulator material: liquid crystal polymer terminal material: phosphor bronze plating: au or sn over 50? (1,27?) ni current rating: contacts: 1.3a @ 95? ground plane: 10.1a @ 95? operating temp range: -55? to +125? voltage rating: 225 vac (5mm stack height) max cycles: 100 unmating force (-rt1 option): -rt1 option increases unmating force up to 50% rohs compliant: ye s processing: lead?free solderable: ye s smt lead coplanarity: (0,10mm) .004" max (020-060) (0,15mm) .006" max (080) board stacking: for applications requiring more than two connectors per board or 4 banks or more, contact ipg@samtec.com application specific option ? 14mm, 15mm, 22mm and 30mm stack height (caution: some automatic placement/inspection machines may have component height restrictions. please consult machinery speci cations.) ? 30? (0,76?) gold (specify -h plating for data rate cable mating applications.) ?edge mount ? 100 positions per row ? guide posts and friction lock options . call samtec. f-211 *note: ? plating passes 10 year mfg testing note: some lengths, styles and options are non-standard, non-returnable. specifications board mates: qte cable mates: eqcd, eqsd, eqdp, eqrf (see application speci c note) qse pins per row no. of pairs plating option ?020, ?040, ?060, ?080 (40 total pins per bank = ?d) ?014, ?028, ?042, ?056 (14 pairs per bank = ?d?dp) ?d = single- ended ?d?dp = differential pair (?01 only) type a other option 01 (0,64) .025 (20,00) .7875 ? = (no. of positions per row/20) x (20,00) .7875 + (1,27) .050 ??p = (no. of positions per row/14) x (20,00) .7875 + (1,27) .050 01 02 (7,49) .295 (0,15) .006 (0,80) .0315 (3,25) .128 (3,05) .120 (0,76) .030 (7,24) .285 (0,89) .035 dia (3,81) .150 (3,76) .148 dia ?01 ?rt1 ?l ?k = (8,25mm) .325" dia polyimide film pick & place pad ?tr = tape & reel packaging (n/a on 56 & 80 positions) ?rt1 = retention option (n/a on 56 & 80 positions or ?l (latch) option) ?l = latching option (n/a on 42, 56, 60 & 80 positions or ?rt1 option) ?f = gold flash on signal pins and ground plane , matte tin on tails ?l = 10" (0,25m) gold on signal pins and ground plane, matte tin on tails ?c* = electro-polished selective 50" (1,27m) min au over 150" (3,81m) ni on signal pins in contact area, 10" (0,25m) min au over 50" (1,27m) ni on ground plane in contact area, matte tin over 50" (1,27m) min ni on all solder tails 5mm stack height type rated @ 3db insertion loss single-ended signaling ?d 9 ghz / 18 gbps differential pair signaling ?d 8 ghz / 16 gbps differential pair signaling ?dp 8.5 ghz / 17 gbps performance data for other stack heights and complete test data available at www.samtec.com?qse or contact sig@samtec.com ? f i n a l i n c h . c o m ? extended life product 10 year mixed flowing gas with 50" gold tm call samtec for maximum cycles mated with qte high speed ground plane socket board spacing standoffs. see so series. also available xaui pci express ? sata mgt (rocket i/o) infiniband download app notes at www.samtec.com/appnote contact sig @ samtec.com for questions on protocols protocols supported ?e.l.p. tm plating option (?) ?retention pin option qte lead style mated height with qse* ?01 (5,00) .197 ?02 (8,00) .315 ?03 (11,00) .433 ?04 (16,00) .630 ?05 (19,00) .748 ?07 (25,00) .984 *processing conditions will affect mated height.


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